NT-H1 3.5g SW Edition

Pro-grade thermal compound

Renowned thermal compound

With more than 150 awards and recommendations

Trusted Noctua quality

With excellent long-term stability

Spatula & Wipes (SW) Edition

Includes spatula for spreading and 3x NA-CW1 cleaning wipes

Noctua’s NT-H1 is a renowned hybrid thermal compound that has received more than 150 awards and recommendations from international hardware websites and magazines. Thanks to its excellent performance, exceptional ease of use and outstanding long-term stability, it has become an established favourite among overclockers and enthusiast users worldwide. Whether it’s air- or water-based cooling, CPU or GPU applications, overclocking or silent systems: NT-H1 is a proven premium paste that’s guaranteed to deliver great results. The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.


Key features

 A hand using a brown Noctua spatula to spread a thin layer of thermal paste evenly over the surface of a CPU.

SW (Spatula & Wipes) Edition

The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.

Award-winning performance

Bundled with Noctua’s premium-grade CPU coolers since 2007, NT-H1 has proven its excellent performance in countless of tests and reviews. Chosen again and again by overclockers and hardware enthusiasts around the globe, it has established itself as a benchmark for premium-quality thermal interface materials (TIMs).

A graph showing thermal resistance (Rλ) remaining stable over time (t), illustrating long-term thermal paste stability.

Excellent long-term stability

NT-H1's unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more.

3.5g package for 3-20 applications

Sufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then.

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