Offset AM5 mounting: technical backgrounds
Offset AM5 mounting: technical backgrounds
AMD’s latest Ryzen processors use a so called chiplet architecture rather than a traditional monolithic chip design. Whereas monolithic designs combine all chip components (e.g. cores, cache, I/O parts) into a single die, chiplet designs use separate dies for individual components. In the case of AMD’s latest Ryzen CPUs, there is one I/O die and, depending on the model, one or two Core Complex Dies (CCDs) that contain the CPU cores. These CCDs are responsible for the majority of the processor’s total heat emission and, since they are located towards the south (lower) side of the processor package rather than in the centre, they create a hotspot in this region:
This is where Noctua’s new offset mounting steps in: It enables customers to install their heatsinks shifted towards the south side of the socket by 7mm, putting them right above the hotspot created by the CCD(s). This has two key benefits: Firstly, optimal contact pressure will be applied where it matters the most, thereby ensuring the most efficient thermal transfer between the CCD(s) and the heatsink. Secondly, with the heatsink being centred above the hotspot, the heat distribution throughout the base of the cooler will be more even, which results in a better balance of the thermal load across the heatpipes and the entire fin surface area:
In sum, the superior contact and better heat distribution throughout the cooler base that are made possible by the offset mounting can significantly reduce CPU temperatures with typical improvements in the range of 1-3°C:
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