NT-H2 3.5g AM5 Edition

When the mounting pressure of the cooling solution is applied, excess thermal paste will be squeezed outwards. With AM5 CPUs, this excess paste tends to accumulate in the cut-outs at the sides of the heatspreader and may become difficult to remove. Simple and risk-free to apply, the NA-TPG1 prevents this undesired phenomenon.

Further improving the award-winning NT-H1, NT-H2 uses a new, fine-tuned mixture of metal oxide micro-particles for even lower thermal resistance and reduced bond-line thickness at typical mounting pressures. This allows it to achieve even better performance in most application scenarios.

The 3.5g pack of NT-H2 includes three large NA-CW1 cleaning wipes that are pre-moistened with an isopropyl alcohol mixture and make it child’s play to remove: Simply wipe off the paste from the CPU and the base of the cooler using one of the wipes and you’re done!

Sufficient for around 3-20 applications (depending on the size of the CPU or GPU, e.g. around 3 applications for large CPUs such as TR4 and around 20 for small CPUs such as LGA1151), the classic 3.5g packaging size is ideal for most users who only install coolers every now and then.